Flame retardant epoxy resin composition and cured object obtained therefrom

ABSTRACT

The invention relates to an epoxy resin composition containing (a) an epoxy resin and (b) a phenolic hydroxy group-containing polyamide resin having the structure represented by Formula (1), a method of curing the composition, a varnish, prepreg, or sheet using the composition, and an epoxy resin composition having the polyamide resin represented by Formula (1) as the active component. 
 
Cured products of the epoxy resin composition according to the present invention have a sufficient high flexibility when formed into a thin film, have a flame resistance even though the cured compositions do not contain a halogen flame retardant, an antimony compound, or the like and are superior in heat resistance and adhesiveness, and thus are extremely useful in a wide range of applications, for example, as molded materials, cast materials, laminate materials, paints, adhesives, resists, and the like.  
                 
 
(wherein, l and m are averages, satisfying the formula: m/(l+m)≧0.05; and l+m is a positive number of 2 to 200. Ar 1  represents a bivalent aromatic group; Ar 2  represents a phenolic hydroxyl group-containing bivalent aromatic group; and Ar 3  represents: 
 
—NH-ph(R 1 )n-NH— or 
 
—NH-ph(R 2 )n-X-ph(R 3 )n-NH—, 
 
wherein, -ph(R 1 )n-, -ph(R 2 )n- and -ph(R 3 )n- represent respectively R 1 -substituted, R 2 -substituted and R 3 -substituted phenylene groups, or an unsubstituted phenylene group; n is an integer of 0 to 3; R 1 , R 2  and R 3  each independently represent a C1 to C3 alkyl group or a C1 to C3 alkoxy group; and X represents O, S, CO, SO 2  or a single bond)

TECHNICAL FIELD

The present invention relates to an epoxy resin curing agent, an epoxyresin composition containing the epoxy resin curing agent, and the curedproduct thereof.

BACKGROUND ART

Epoxy resins are cured with a variety of curing agents intocuredproducts generally superior in mechanical properties, water resistance,chemical resistance, heat resistance, electrical properties, and thelike, and have been used, for example, as adhesives, paints, laminatedplates, molding materials, and casting materials in a wide range ofindustrial fields. Conventionally, the epoxy resins that have been usedmost widely are bisphenol A epoxy resins. Acid anhydrides and aminecompounds are known as the curing agents for epoxy resins, but phenolicnovolak resins are often used in the field of electric and electronicparts for the purpose of improving reliability, for example, of heatresistance. Flame retardants are often used for the purpose of improvingflame resistance of the cured products, and bromine-containing compoundssuch as tetrabromobisphenol A and the epoxidized derivatives thereof,and the reaction products from tetrabromobisphenol A and a bisphenol Aepoxy resin are generally known as such flame retardants.

However, although the bromine-containing compounds described above areeffective in making resins superior in flame resistance, they arepointed out to generate the substances possibly causing environmentalpollution during disposal and incineration. In addition, there is also aconcern about the toxicity of the antimony compounds that are used asthe flame retardant aids. Among the recent enhanced recognition aboutenvironmental protection, there is an increasing need for halogen-freeand antimony-free epoxy resin compositions. In addition, cured epoxyresins prepared by using a phenolic novolak as the curing agent aresuperior in reliability, but the cured products are rigid and lackflexibility. There are recently various electric and electronic partsdifferent in shape, and in addition to plate-shaped parts usingconventional large package and rigid base plates containing glasstextile as a base material, sheet-shaped parts (shaped products) using aflexible sheet-shaped base material such as polyimide film, PET(polyethylene terephthalate) film, or metal foil have been developed.The shaped products are usually produced by coating an epoxy resincomposition in the form of varnish on a sheet-shaped base plate,removing the solvent, and then curing the coated epoxy resincomposition. In such a case, the cured product obtained should besufficient flexible and highly adhesive to the base material, forexample, of polyimide. The cured product should also have a high heatresistance, from the viewpoint of the reliability of the resultingelectric and electronic parts.

Separately, an epoxy resin composition containing an epoxy resin, aphenol resin and a phenolic hydroxyl group-containing aromatic polyamideresin was disclosed as an epoxy resin improved in the fragilityassociated with conventional epoxy resin compositions in JP-A No.2000-313787, and was described to have a high heat resistance andtoughness. However, the flexibility and the flame resistance thereof,which are able to be used for a sheet-shaped base plate, are notdescribed there and seem to be still unsatisfactory.

DISCLOSURE OF THE INVENTION

Under the circumstances above, the inventors have conducted an intensivestudy for an epoxy resin composition that gives a cured productresistant to flame even without an added bromine-based or other flameretardant, superior in heat resistance and adhesiveness, andsufficiently flexible when formed into the sheet shape in case ofcuring, and completed the present invention.

Namely, the present invention relates to the followings:

-   1. An epoxy resin composition, characterized by containing an epoxy    resin (a) and a polyamide resin (b) having the structure represented    by the following Formula (1)    (wherein, l and m are averages, satisfying the formula:    m/(l+m)≧0.05; and l+m is a positive number of 2 to 200. Ar₁    represents a bivalent aromatic group; Ar₂ represents a phenolic    hydroxyl group-containing bivalent aromatic group; and Ar₃    represents:    —NH-ph(R₁)n-NH— or    —NH-ph(R₂)n-X-ph(R₃)n-NH—,    wherein, -ph(R₁)n-, -ph(R₂)n- and -ph(R₃)n- represent respectively    R₁-substituted, R₂-substituted and R₃-substituted phenylene groups,    or an unsubstituted phenylene group; n is an integer of 0 to 3; R₁,    R₂ and R₃ each independently represent a C1 to C3 alkyl group or a    C1 to C3 alkoxy group; and X represents O, S, CO, SO₂ or a single    bond);-   2. The epoxy resin composition according to above mentioned 1,    wherein the equivalence of the active hydrogen in component (b) is    0.7 to 1.2 equivalences relative to 1 equivalence of the epoxy group    in component (a);-   3. The epoxy resin composition according to above mentioned 1,    wherein the content of the polyamide resin of component (b) is 30 wt    % or more relative to all curing agents contained in the    composition;-   4. The epoxy resin composition according to above mentioned 1,    containing the epoxy resin of component (a) in an amount of 2 to 50    wt % and the curing agent of component (b) in an amount of 50 to 98    wt % in the entire composition;-   5. The epoxy resin composition according to any one of above    mentioned 1 to 4, wherein Ar₃ is a group represented by:    —NH-ph(R₁)n-NH— or    —NH-ph(R₂)n-O-ph(R₃)n-NH—;-   6. The epoxy resin composition according to any one of above    mentioned 1 to 4, wherein the polyamide resin of component (b) is a    compound having the structure represented by the following Formula    (3):    (wherein l and m are the same as those in Formula (1));-   7. The epoxy resin composition according to any one of above    mentioned 1 to 4, wherein the polyamide resin of component (b) is a    compound having the structure represented by the following Formula    (4):    (wherein l and m are the same as those in Formula (1));-   8. The epoxy resin composition according to any one of above    mentioned 1 to 4, wherein l+m is a positive number of 2 to 20;-   9. The epoxy resin composition according to any one of above    mentioned 1 to 4, wherein the component (a) is one or more resins    selected from the group consisting of novolak epoxy resins, xylylene    skeleton-containing phenolic novolak epoxy resins, biphenyl    skeleton-containing novolak epoxy resins, bisphenol A epoxy resins,    bisphenol F epoxy resins, tetramethylbiphenol epoxy resins and    triphenylmethane epoxy resins; 10. The epoxy resin composition    according to above mentioned-   8, wherein the component (a) is a biphenyl skeleton-containing    novolak epoxy resin represented by the following Formula (2):    (wherein, p is an average having a positive number of 0.1 to 10);-   11. The epoxy resin composition according to any one of above    mentioned 1 to 4, further containing a curing accelerator;-   12. A varnish, prepared by dissolving the epoxy resin composition    according to any one of above mentioned 1 to 11 in a solvent;-   13. A varnish, containing a solvent and the epoxy resin composition    according to above mentioned 12 respectively in amounts of 10 to 70    wt % and the balance relative to all amount of the varnish;-   14. The varnish according to above mentioned 13, wherein the solvent    is a C4 to C6 aliphatic ketone solvent;-   15. A sheet, having a planar backing and one or two layers of the    epoxy resin composition according to any one of above mentioned 1 to    11 formed on one or two faces thereof;-   16. A sheet, having a cured product layer prepared by curing the one    or two layers of the epoxy resin composition according to any one of    above mentioned 1 to 11 formed on one or two faces of a planar    backing;-   17. The sheet according to above mentioned 16 or 17, wherein the    planar backing is a polyimide film, a metal foil, or a release film;-   18. A prepreg, being prepared by impregnating a base material with    the varnish according to above mentioned 12 and drying the resulting    base material-   19. A method of curing an epoxy resin composition, heating the epoxy    resin composition according to any one of above mentioned 1 to 11;-   20. A curing agent for an epoxy resin, containing, as an active    ingredient, a polyamide resin having the structure represented by    the following Formula (1):    (wherein, 1 and m are averages, satisfying the formula:    m/(l+m)≧0.05; and l+m is a positive number of 2 to 200; Ar₁    represents a bivalent aromatic group; Ar₂ represents a phenolic    hydroxyl group-containing bivaleht aromatic group; Ar₃ represents:    —NH-ph(R₁)n-NH— or    —NH-ph(R₂)n-X-ph(R₃)n-NH—;    -ph(R₁)n-, -ph(R₂)n- and -ph(R₃)n- represent respectively,    R₁-substituted, R₂-substituted and R₃-substituted phenylene groups,    or an unsubstituted phenylene group; n is an integer of 0 to 3; R₁,    R₂ and R₃ each independently represent a C1 to C3 alkyl group or a    C1 to C3 alkoxy group; and X represents 0, S, CO, SO₂ or a single    bond); and-   21. The epoxy resin curing agent according to above 20, wherein Ar₃    is a group represented by:    —NH-ph(R₁)n-NH— or    —NH-ph(R₂)n-O-ph(R₃)n-NH—.

BEST MODE FOR CARRYING OUT THE INVENTION

The polyamide resin for use in the present invention is a phenolichydroxyl group-containing aromatic polyamide resin having the structurerepresented by Formula (1) above in its polymer structure. The phenolichydroxyl group-containing aromatic polyamide resin can be prepared, in asimilar manner, for example, to the phenolic hydroxyl group-containingaromatic polyamide resins specifically described in JP-A No. 8-143661,by polycondensation of a phenolic hydroxyl group-containing aromaticdicarboxylic acid corresponding to Formula (1) above (hereinafter, alsoreferred to as a phenolic hydroxyl group-containing aromaticdicarboxylic acid), an aromatic dicarboxylic acid having no phenolichydroxyl group corresponding to Formula (1) above mentioned, and anaromatic diamine corresponding to Formula (1) above mentioned (diaminerepresented by Formula (i) or (ii) below).

If the polycondensation is carried out in the presence of a phosphorousester and a pyridine derivative as the condensing agents, straight-chainaromatic polyamide resins can be easily produced without protection ofthe functional group, i.e., phenolic hydroxyl group, and without thereactions between the phenolic hydroxyl group and other reaction groupssuch as carboxyl and amino groups. In addition, the polycondensationdoes not demand high temperature, and can be carried out advantageouslyat around 150° C. or less.

Examples of the aromatic diamines corresponding to Formula (1) aboveinclude the aromatic diamines represented by the following Formula:H₂N-ph(R₁)n-NH₂ or   (i)H₂N-ph(R₂)n-X-ph(R₃)n-NH₂   (ii)(wherein, -ph(R₁)n-, -ph(R₂)n- and -ph(R₃)n- respectively represent R₁substituted, R₂ substituted and R₃ substituted phenylene groups, or anunsubstituted phenylene group; n is an integer of 0 to 3; R₁, R₂ and R₃each independently represent a C1 to C3 alkyl group or a C1 to C3 alkoxygroup; and X represents O, S, CO, SO₂ or a single bond), and a phenylenediamine of Formula (i) or a diaminodiphenylether of Formula (ii) whereinX is O is preferable.

Examples of the aromatic diamines of the Formula (i) or (ii) includephenylenediamine derivatives such as m-phenylenediamine,p-phenylenediamine, and m-tolylenediamine; diaminodiphenyletherderivatives such as 4,4′-diaminodiphenylether,3,3′-dimethyl-4,4′-diaminodiphenylether, and 3,4′-diaminodiphenylether;diaminodiphenylthioether derivatives such as4,4′-diaminodiphenylthioether,3,3′-dimethyl-4,4′-diaminodiphenylthioether,3,3′-diethoxy-4,4′-diaminodiphenylthioether,3,3′-diaminodiphenylthioether, and3,3′-dimethoxy-4,4′-diaminodiphenylthioether; diaminobenzophenonederivatives such as 4,4′-diaminobenzophenone, and3,3′-dimethyl-4,4′-diaminobenzophenone; diaminodiphenylsulfonederivatives such as 4,4′-diaminodiphenylsulfoxide, and4,4′-diaminodiphenylsulfone; benzidine derivatives such as benzidine,3,3′-dimethylbenzidine and 3,3′-dimethoxybenzidine;3,3′-diaminobiphenyl; xylylenediamine derivative such asp-xylylenediamine, m-xylylenediamine, and o-xylylenediamine; and thelike, and the phenylenediamine or diaminodiphenylether derivatives arepreferable, and further, 3,4′-diaminodiphenylether is particularlypreferable from the points of solvent solubility and flame resistance.These diamines may be used alone or in combination of two or more.

The phenolic hydroxyl group-containing aromatic dicarboxylic acid foruse in the present invention is not particularly limited if its aromaticring has a structure containing one carboxyl group and one or morehydroxyl groups, and examples thereof include dicarboxylic acids havingone hydroxy group and two carboxyl groups on the benzene ring such as5-hydroxyisophthalic acid, 4-hydroxyisophthalic acid,2-hydroxyisophthalic acid, 3-hydroxyisophthalic acid, and2-hydroxyterephthalic acid.

In addition, examples of the aromatic dicarboxylic acids having nophenolic hydroxyl group for the polyamide resin for use in the presentinvention include, but are not limited to, phthalic acid, isophthalicacid, terephthalic acid, 4,4′-oxy dibenzoic acid,4,4′-biphenyldicarboxylic acid, 3,3′-methylenedibenzoic acid,4,4′-methylenedibenzoic acid, 4,4′-thio dibenzoic acid,3,3′-carbonyldibenzoic acid, 4,4′-carbonyldibenzoic acid,4,4′-sulfonyldibenzoic acid, 1,5-naphthalenedicarboxylic acid,1,4-naphthalenedicarboxylic acid, 2,6-naphthalenedicarboxylic acid,1,2-naphthalenedicarboxylic acid, and the like. Dicarboxylic acidshaving two carboxyl groups on the benzene ring are usually preferable.

In regard to the ratio of the aromatic dicarboxylic acid having nophenolic hydroxyl group to the aromatic dicarboxylic acid having aphenolic hydroxyl group, the phenolic hydroxyl group-containing aromaticdicarboxylic acid is preferably contained in an amount of 5 mole % ormore, more preferably 10 mole % or more, relative to all dicarboxylicacids. When the dicarboxylic acids are used at the ratio above, theresulting polyamide resin normally satisfies the following condition inFormula (1):m/(l+m)≧0.05, preferably m/(l+m)≧0.1. The values of m and lcan be determined, for example, by gel-permeation chromatography, NMR,or others.

Examples of the phosphorous esters for use as the condensing agentinclude, but are not limited to, triphenyl phosphite, diphenylphosphite, tri-o-tolyl phosphite, di-o-tolyl phosphite, tri-m-tolylphosphite, tri-p-tolyl phosphite, di-p-tolyl phosphite,di-p-chlorophenyl phosphite, tri-p-chlorophenylphosphite,di-p-chlorophenylphosphite, and the like.

In addition, examples of the pyridine derivatives for use together withthe phosphorous ester include pyridine, 2-picoline, 3-picoline,4-picoline, 2,4-lutidine, and the like. The pyridine derivative used asa condensing agent is usually used as it is added to an organic solvent.

Preferably, the organic solvent does not practically react with thephosphorous ester, dissolves the aromatic diamine and the aromaticdicarboxylic acid, and is a good solvent for the reaction product, i.e.,the phenolic hydroxyl group-containing aromatic polyamide resin.Examples of such organic solvents include amide solvents such asN-methylpyrrolidone and dimethylacetamide, and N-methyl-2-pyrrolidone ispreferable. Normally, a mixture of a pyridine derivative and a solventcontaining the pyridine derivative in an amount of 5 to 30 wt % is used.

For production of a polyamide resin having a higher polymerizationdegree, it is preferable to add an inorganic salt such as lithiumchloride, calcium chloride, or the like, in addition to the phosphorousester and the pyridine derivative.

Hereinafter, the method of producing the polyamide resin of Formula (1)will be described in more detail.

A phosphorous ester is first added to a mixed solvent of an organicsolvent containing a pyridine derivative; an aromatic dicarboxylic acidand an aromatic diamine in an amount of 0.5 to 2 moles relative to 1mole of the dicarboxylic acid are added thereto; and the mixture isstirred under heat and a nitrogen or other inactive atmosphere. Afterthe reaction, the reaction mixture is poured into a poor solvent such asmethanol or hexane, separating purified polymer; and furtherpurification by reprecipitation method for removal of byproducts,inorganic salts, and the like gives a desirable polyamide resin.

In the production method above mentioned, the amount of the condensingagent, phosphorous ester, added is normally one mole or more relative toone mole of the carboxyl group, but an amount of 30 moles or more is notefficient. The amount of the pyridine derivative should be equal amountsof mole or more relative to that of the carboxyl group, but the pyridinederivative, which also plays a role as a reaction solvent, is often usedin an excessive amount in practice. Theoretically, the use amount of themixture of the pyridine derivative and the organic solvent is preferablyin the range of 5 to 30 wt parts relative to 100 wt parts of theresulting polyamide resin. The reaction temperature is normally 60 to180° C. The reaction time is greatly dependent on the reactiontemperature. The reaction system is preferably stirred until thereaction solution reaches the highest-viscosity (highest polymerizationdegree) in any case, and the reaction times is normally several minutesto 20 hours.

The intrinsic viscosity of the phenolic hydroxyl group-containingaromatic polyamide resin having a favorable average polymerizationdegree (as determined by using a 0.5 g/dl N,N-dimethylacetamide solutionat 30° C.) is in the range of 0.1 to 4.0 dl/g, normally 0.2 to 2.0 dl/g,preferably 0.35 to 0.70 dl/g, and particularly preferably 0.40 to 0.60dl/g. Generally, the intrinsic viscosity is used for judging whether aresin has a favorable average polymerization degree. An aromaticpolyamide resin having an intrinsic viscosity of less than 0.1 dl/g isunfavorable, as it has a poor film-forming capability and exhibitsinsufficient properties as the aromatic polyamide resin. On thecontrary, the resin having an intrinsic viscosity of greater than 4.0dl/g, i.e., an excessively high polymerization degree, causes problemssuch as low solvent solubility and deterioration in processability.

A simple method of adjusting the polymerization degree of polyamideresin is, for example, to use one of the aromatic diamine and thearomatic dicarboxylic acid in an excessive amount. Generally, use of onecomponent in an excessive amount results in decrease in the molecularweight of the resulting polymer and gives a polyamide resin having theterminal groups corresponding to the material excessively used. Althoughuse of equal amounts of these components is preferable for production ofa high-molecular weight polyamide resin, polyamide resins having aminogroups at both ends (compound represented by Formula (1) having ahydrogen atom at the right end and H₂N—Ar₃—NH— at the left end) arepreferable from the viewpoint of adhesiveness. Such a polyamide resin isobtained when an aromatic diamine is used in excess relative to thearomatic dicarboxylic acid by about 0.1 to 20 mole %, preferably 0.2 to15 mole %, and more preferably 0.5% to 15 mole %. In some cases, anexcess of 1 to 5 mole % is most preferable.

The total (average polymerization degree) of 1 and m of the polyamideresin of Formula (1) obtained above depends on the polymerizationcondition, the starting compound used, and the like, but is normally inthe range of 2 to 200. Polyamide resins having a total l+m ofapproximately 2 to 40 are favorable from the viewpoints of low viscosityand processability. Further, a resin having a total of 10 or more givesa cured product which can be processed into a film; that of 20 or more,a cured product suitable for the film; that of 30 or more, a curedproduct suitable for the film; and that of about 50 to 200, a curedproduct higher in flexibility. A flexible cured product is preferablewhen the epoxy resin composition according to the present invention isused to be processed into a film. Thus preferably, the averagepolymerization degree of the polyamide resin according to the presentinvention is suitable selected according to the application of the curedcomposition containing the same. Considering the application as a filmor the like, the cured product is preferably both flexible and easilyprocessable (less viscous), and thus, the average polymerization degreeis approximately 10 to 60, preferably approximately 20 to 55, andparticularly preferably about 40, or 35 to 45. A preferable viscosity isfavorably determined by using the intrinsic viscosity above as anindicator.

The polyamide resin of Formula (1) prepared in the manner describedabove is suitable as an epoxy resin curing agent and used as the epoxyresin curing agent containing the resin as an active ingredient.

The content of the polyamide resin in the epoxy resin compositionaccording to the present invention is normally 30% or more (by weight,the same shall apply unless specified otherwise), preferably 40% ormore, and more preferably 50% or more relative to the total composition,and the upper limit is normally approximately 98% or less and preferably95% or less.

Various epoxy resins may be used as the epoxy resin compositionaccording to the present invention. The epoxy resin is not particularlylimited, if it is used for electric and electronic parts. Examplesthereof include alicyclic epoxy resins; aromatic epoxy resin; reactionproducts from a polyvalent alcohol such as sorbitol polyglycidylether,polyglycerol polyglycidylether, diglycerol polyglycidylether,pentaerythritol polyglydidylether, glycerol polyglycidylether,trimethylolpropane polyglycidylether, neopentylglycol diglycidylether,or 1,6-hexanediol diglycidylether and an epichlorohydrin;-alicyclic orstraight-chain epoxy resins prepared by oxidation of the double bondswith a peroxide or the like; and the like. The epoxy resin for use inthe present invention has an epoxy equivalence (as determined accordingto JIS-K-7236) normally of approximately 50 to 600 g/eq, preferablyapproximately 100 to 450 g/eq, and more preferably approximately 120 to350 g/eq.

Among the epoxy resins above mentioned, aromatic epoxy resins arepreferable, from the viewpoint of the flame resistance of cured product.The preferable aromatic epoxy resin is not particularly limited, if ithas aromatic rings such as benzene, biphenyl, or naphthalene and epoxygroups in the molecule. Specific examples thereof include novolak epoxyresins, xylylene skeleton-containing phenolic novolak epoxy resins,biphenyl skeleton-containing novolak epoxy resins, bisphenol A epoxyresins, bisphenol F epoxy resins, tetramethylbiphenol epoxy resins, andthe like.

Among the epoxy resins above, biphenyl skeleton-containing novolak epoxyresins are preferably, and the epoxy resins represented by Formula (2)above are particularly preferable for ensuring a sufficient flameresistance and a flexibility of cured product. The epoxy resins ofFormula (2) are easily available as commercial products, for example,NC-3000 and NC-3000-H (both of manufactured by Nippon Kayaku Co., Ltd).

According to the present invention, as curing agents, the polyamideresins having the structure represented by Formula (1), and other curingagents may be used in combination in the epoxy resin composition.Typical examples of the curing agents used in combination include, butare not limited to, diaminodiphenylmethane, diethylenetriamine,triethylenetetramine, diaminodiphenylsulfone, isophoronediamine,dicyandiamide, polyamide resins prepared from linoleic acid dimer andethylenediamine, phthalic anhydride, trimellitic anhydride, pyromelliticanhydride, maleic anhydride, tetrahydrophthalic anhydride,methyltetrahydrophthalic anhydride, methylnadic anhydride,hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, phenolicnovolak, triphenylmethane and the modified derivatives thereof,imidazole, BF₃-amine complex, guanidine derivatives, and the like. Thecontent of the polyamide resin represented by Formula (1) in the entirecuring agent is normally 20% or more, preferably 30% or more, and stillmore preferably 40% to 100%.

In regard to the content of the curing agent in the epoxy resincomposition according to the present invention, the equivalence of theactive group of curing agent reactive with the epoxy group is normally0.4 to 1.5, preferably 0.6 to 1.3, and still more preferably 0.7 to 1.2relative to 1 equivalence of the epoxy group of epoxy resin. In the caseof the polyamide of Formula (1) of the present invention, it is theequivalence of the phenolic hydroxyl group that is reactive with epoxygroup (active hydrogen equivalence). The active hydrogen equivalence canbe determined, for example, by NMR, but values calculated from theamount of phenolic hydroxyl group-containing diamine supplied were usedfor convenience in the Examples below.

In addition, a curing accelerator may be used together when the curingagent is used. Typical examples of the curing accelerators includeimidazoles such as 2-methylimidazole, 2-ethylimidazole, and2-ethyl-4-methylimidazole; tertiary amines such as2-(dimethylaminomethyl)phenol and 1,8-diaza-bicyclo(5,4,0)undecene-7;phosphines such as triphenylphosphine; metal compounds such as tinoctbate; and the like. The curing accelerator is used as needed in anamount of 0.1 to 5.0 wt parts relative to 100 wt parts of epoxy resin.

The epoxy resin composition according to the present invention maycontain an inorganic filler as needed. Typical examples of the inorganicfillers include silica, alumina, talc, and the like. The inorganicfiller is used in the epoxy resin composition according to the presentinvention in an amount of 0 to 90 wt %. The epoxy resin compositionaccording to the present invention may further contain variouscompounding agents including silane-coupling agent, mold release agentsuch as stearic acid, palmitic acid, zinc stearate, or calcium stearate,pigment, and the like.

A preferable epoxy resin composition according to the present inventioncontains a polyamide resin of Formula (1) having a phenylene group asAr₁, a hydroxy-substituted phenylene group as Ar₂, and a grouprepresented by —NH-ph(R₁)n-NH— or —NH-ph(R₂)n-O-ph(R₃)n-N— as Ar₃; anepoxy resin represented by Formula (2); and an curing accelerator asneeded.

The epoxy resin composition according to the present invention isobtained by blending the respective components uniformly. The epoxyresin composition according to the present invention can be produced,for example, by blending an epoxy resin, an curing agent containing thepolyamide resin of Formula (1), and as needed, a curing accelerator, aninorganic filler, and another compounding agent in an extruder or ankneader roll sufficiently until the mixture becomes uniform. The resincomposition can be easily converted to a cured product thereof, byforming the composition into a suitable shape as needed and curing thecomposition by a method similar to known methods, for example, byheating. Specifically, the cured product can be produced by molding aresin composition as needed, for example, by melt casting, transfermolding, injection molding, compression molding, or the like andadditionally heating the composition at 80 to 200° C. for 2 to 10 hours.The cured product preferably has a higher glass transition temperature,for example, a glass transition temperature as determined by DMA methodof 200° C. or more and more preferably 220° C. or more, from the viewpoint of heat resistance. Although there is no particular upper limit,the glass transition temperature is usually about 300° C. or less, forproviding the cured product with flexibility.

The varnish according to the present invention is prepared by dissolvingthe epoxy resin composition according to the present invention in asolvent. Examples of the solvents include γ-butylolactones; amidesolvents such as N-methylpyrrolidone (NMP), N,N-dimethyl formamide(DMF), N,N-dimethylacetamide, and N,N-dimethylimidazolidinone; sulfonessuch as tetramethylenesulfone; ether solvents such as diethyleneglycoldimethylether, diethyleneglycol diethylether, propylene glycol,propylene glycol monomethylether, propylene glycol monomethylethermonoacetate, and propylene glycol monobutylether; ketone solvents suchas acetone, methylethylketone, methylisobutylketone, cyclopentanone, andcyclohaxanone; aromatic solvents such as toluene and xylene; and thelike. Among them, ketone solvents, in particular C4 to C6 aliphaticketone solvents, are suitable for mixing the resin composition accordingto the present invention uniformly. The solid matter concentration ofthe varnish obtained is usually 10 to 80 wt % and preferably 10 to 70 wt%.

Sheets having a layer of the epoxy resin composition according to thepresent invention are prepared by coating and drying the varnish aboveon a base material, usually a planar substrate. In such a case, arelease sheet is usually used as the base material.

The sheets having a cured product layer obtained by curing a layer ofthe epoxy resin composition according to the present invention areprepared by curing under heat the layer obtained by coating and dryingthe varnish above on a backing (base material), usually a planarbacking. Namely, the resin composition layer is obtained by coating anddrying the varnish above on a planar substrate by any one of variousknown coating methods such as gravure coating, screen printing, metalmask method, spin coating, and the like to a desirable dry thickness,for example, of 5 to 100 μm. The coating method is selected suitablyaccording to the kind and the size of base material and the desirablethickness of the coated film. Examples of the base materials includefilms of various polymers such as polyamide, polyimide, polyamide-imide,polyarylate, polyethylene terephthalate, polybutylene terephthalate,polyether ether ketone, polyether imide, polyether ketone, polyketone,polyethylene, and polypropylene and/or the copolymers thereof; and metalfoils such as copper foil, and a polyimide film or a metal foil ispreferable. The sheet having the resin composition layer thus obtainedmay be used as it is for the next curing; or alternatively depending onthe application, may be subjected to the next curing treatment after thesheet is prepared by using a release film as the base material andcovering the surface of the layer with a protective sheet as needed,adhering the resin composition layer on another substrate after removalof the protective sheet during use, and processing as needed afterremoval of the release film.

A sheet having a cured product layer is prepared then by heating theresin composition layer obtained. Favorable examples of the applicationsof the sheet according to the present invention include flexible printedwiring board materials such as substrates for flexible printing wiring,cover lay materials, bonding sheet, and the like, and the epoxy resincomposition according to the present invention functions as an adhesivefor these materials.

Prepregs using the epoxy resin composition according to the presentinvention can be prepared by impregnating the base material, forexample, of glass fiber, carbon fiber, polyester fiber, polyamide fiber,alumina fiber, paper, or the like with a varnish obtained by dissolvingthe resin composition in the solvent above and heating and drying thebase material. Cured products of the prepregs can be obtained by formingand curing the prepregs obtained, for example, by heat press molding.The content of the solvent at that time is usually approximately 10 to70%, preferably 15 to 70%, relative to the total of the resincomposition and the solvent.

EXAMPLES

Hereinafter, the present invention will be described more specificallywith reference to Examples and Comparative Examples. In the followingExamples, parts are weight parts unless specified otherwise.

Example 1

In a flask equipped with a thermometer, a condenser, and a stirrer wereadded 45.5 parts of 5-hydroxyisophthalic acid, 41.5 parts of isophthalicacid, 55.1 parts of m-phenylenediamine, 3.4 parts of lithium chloride,344 parts of N-methyl-2-pyrrolidone, and 115.7 parts of pyridine undernitrogen gas flow, and the mixture was stirred and dissolved. 251 partsof triphenyl phosphite was added thereto, and the mixture was allowed toreact at 9° C. for 4 hours, to give a solution of a phenolic hydroxylgroup-containing polyamide resin. After cooling the reaction solution toroom temperature, the reaction solution was added into 500 parts ofmethanol to precipitating a resin represented by the following Formula(3):

The resin precipitate was washed additionally with 500 parts of methanoland further purified under ref lux of methanol, to give 120 parts ofpolyamide resin (A). The intrinsic viscosity of the polyamide resin (A)was 0.49 dl/g (dimethylacetamide solution, 30° C.); l and m in Formula(3) were respectively approximately 6 and approximately 6; and theequivalence of the active hydrogen reactive with epoxy group was 417g/eq.

Example 2

166 parts of a polyamide resin (B) represented by the following Formula(4) was obtained in a similar manner to Example 1, except that 55.1parts of m-phenylenediamine was replaced with 102 parts of3,4′-diaminodiphenylether.

The intrinsic viscosity of the polyamide resin (B) obtained was 0.56dl/g (dimethylacetamide solution, 30° C.); l and m in Formula (4) wererespectively approximately 20 and approximately 20; and the equivalenceof the active hydrogen reactive with epoxy group was 633 g/eq.

Example 3

A resin represented by the Formula (4) was precipitated in a similarmanner to Example 2, except the amounts of 5-hydroxyisophthalic acid andisophthalic acid in Example 2 were changed respectively to 13.0 and 71.1parts. The precipitated resin was washed with 500 parts of methanol andfurther purified under reflux of methanol, to give 163 parts ofpolyamide resin (C). The intrinsic viscosity of the polyamide resin (C)obtained was 0.54 dl/g (dimethylacetamide solution, 30° C.); l and m inFormula (4) were respectively approximately 34 and approximately 6; andthe equivalence of the active hydrogen reactive with epoxy group was1,868 g/eq.

Application Examples 1 to 4

A varnish according to the present invention was obtained by mixing anepoxy resin NC-3000 represented by Formula (2) (manufactured by NipponKayaku Co., Ltd., epoxy equivalence: 275 g/eq, softening point: 58° C.,p: 2.5) (NC-3000 in the Table) and a liquid bisphenol A epoxy resinRE-310S (manufactured by Nippon Kayaku Co., Ltd., epoxy equivalence: 184g/eq) (RE-310 in the Table) as epoxy resins; triphenylphosphine (TPP) asa curing accelerator; and cyclopentanone as a solvent at the weightratio shown in Table 1, to the polyamide resin (A) or (B) obtained inExample 1 or 2 TABLE 1 Application Example 1 2 3 4 NC-3000 100 100 100RE-310 100 Polyamide resin (A) 136 203 Polyamide resin (B) 188 281 TPP 22 2 2 Cyclopentanone 238 290 305 383

Each of the four varnishes according to the present invention above wasapplied on a PET film to a dry thickness of 50 μm and cured by heatingat 180° C. for 1 hour, and after removal of the PET film, a sheet sample(thickness: 12.5 μm) was obtained. The sample obtained was no crackingby bending and had a sufficiently high film-forming capability. A flameresistance test of the cured product was performed according to UL94-VTM. Separately, the glass transition temperatures of these sampleswere determined by DMA (Dynamic Mechanical Analysis). In addition, eachvarnish obtained was coated on a polyimide film having a thickness of 25μm (Upilex 25SGA, manufactured by Ube Industries, Ltd) to a drythickness of 10 μm by using an applicator. After removal of solvent bydrying at 100° C. for 10 minutes, a same polyimide film was overlaid onthe resultant resin layer and the resin layer was cured at 180° C. for 1hour. The degrees of exfoliation (orthogonal exfoliation) of respectivesamples were evaluated. Results are summarized in Table 2. TABLE 2Application Example 1 2 3 4 Flame V-0 V-0 V-0 V-0 resistance test Glass245 234 232 228 transition temperature (° C.) Exfoliation CohesiveCohesive Cohesive Cohesive test failure failure failure failure

In the Table, V-0 in the line of the flame resistance test indicates thehighest mark in the flame resistance of plastics. In the exfoliationtest, the degree of exfoliation was examined by pulling one of the twoadhered films gradually in the orthogonal angle (90°) after the adheredfilm is fixed. The cohesive failure in the Table means that the film isdamaged without exfoliation of two films.

Application Examples 5 to 8

A varnish according to the present invention was obtained by mixing atriphenyl methane epoxy resin EPPN-502H (manufactured by Nippon KayakuCo., Ltd., epoxy equivalence 170 g/eq, softening point 65° C.)(EPPN-502H in the Table) or a liquid bisphenol F epoxy resin RE-304S(manufactured by Nippon Kayaku Co., Ltd., epoxy equivalence 170 g/eq)(RE-304S in the Table) as an epoxy resin;2-phenyl-4,5-dihydroxymethylimidazole (2PHZ) as a curing accelerator;and cyclopentanone as a solvent at a weight ratio shown in Table 3 tothe polyamide resin (B) or (C) obtained in Example 2 or 3. TABLE 3Application Example 5 6 7 8 RE-304S 100 100 EPPN-502H 100 100 Polyamideresin (B) 372 372 Polyamide resin (C) 1098 1098 2PHZ 2 2 2 2Cyclopentanone 474 1200 474 1200

Each of the four varnishes according to the present invention above wasapplied on a PET film to a dry thickness of 50 μm and cured by heatingat 180° C. for 1 hour, and after removal of the PET film, a sheet samplewas obtained. The sample obtained was resistant to the cracking bybending and had a sufficiently high film-forming capability. A flameresistance test of the cured product was performed according to UL94-VTM. Separately, the glass transition temperatures of these sampleswere determined by DMA. In addition, each varnish obtained was coated ona polyimide film having a thickness of 25 μm (Upilex 25SGA, manufacturedby Ube Industries, Ltd) to a dry thickness of 18 μm by using anapplicator. After drying and solvent removal at 100° C. for 10 minutes,the same polyimide film or the roughened surface of a surface-modifiedcopper foil was overlaid on the resin film, and the laminate was curedat 180° C. for 1 hour in a hot plate pressing machine. The degrees ofexfoliation (orthogonal exfoliation) of respective samples wereevaluated. Results are summarized in Table 4. TABLE 4 ApplicationExample 5 6 7 8 Flame resistance V-0 V-0 V-0 V-0 test Glass transition235 242 260 272 temperature (° C.) Exfoliation test Cohesive CohesiveCohesive Cohesive (polyimide) failure failure failure failureExfoliation test Cohesive Cohesive Cohesive Cohesive (copper foil)failure failure failure failure

INDUSTRIAL APPLICABILITY

Cured products of the epoxy resin composition according to the presentinvention have a sufficient high flexibility when formed into a thinfilm, have a flame resistance even though the cured products do notcontain a halogen flame retardant, an antimony compound, or the like andare superior in heat resistance and adhesiveness, and thus are extremelyuseful in a wide range of applications, for example, as moldedmaterials, cast materials, laminate materials, paints, adhesives,resists, and the like.

1. An epoxy resin composition, characterized by containing an epoxyresin (a) and a polyamide resin (b) having the structure represented bythe following Formula (1):

wherein, l and m are averages, satisfying the following formula:m/(l+m)≧0.05; and l+m is a positive number of 2 to 200; Ar₁ represents abivalent aromatic group; Ar₂ represents a phenolic hydroxylgroup-containing bivalent aromatic group; Ar₃ represents:—NH-ph(R₁)n-NH— or—NH-ph(R₂)n-X-ph(R₃)n-NH—, wherein, -ph(R₁)n-, -ph(R₂)n- and -ph(R₃)n-represent respectively R₁-substituted, R₂-substituted and R₃-substitutedphenylene groups, or unsubstituted phenylene group; n is an integer of 0to 3; R₁, R₂ and R₃ each independently represent a C1 to C3 alkyl groupor a C1 to C3 alkoxy group; and X represents O, S, CO, SO₂ or a singlebond.
 2. The epoxy resin composition according to claim 1, wherein theequivalence of the active hydrogen in component (b) is 0.7 to 1.2equivalences relative to 1 equivalence of the epoxy group in component(a).
 3. The epoxy resin composition according to claim 1, wherein thecontent of the polyamide resin of component (b) is 30 wt % or morerelative to all curing agents contained in the composition.
 4. The epoxyresin composition according to claim 1, comprising the epoxy resin ofcomponent (a) in an amount of 2 to 50 wt % and the curing agent ofcomponent (b) in an amount of 50 to 98 wt % in the entire composition.5. The epoxy resin composition according to any one of claims 1 to 4,wherein Ar₃ is a group represented by:—NH-ph(R₁)n-NH— or—NH-ph(R₂)n-O-ph(R₃)n-NH—.
 6. The epoxy resin composition according toany one of claims 1 to 4, wherein the polyamide resin of component (b)is a compound having the structure represented by the following Formula(3):

wherein l and m are the same as those in Formula (1).
 7. The epoxy resincomposition according to any one of claims 1 to 4, wherein the polyamideresin of component (b) is a compound having the structure represented bythe following Formula (4):

wherein 1 and m are the same as those in Formula (1)
 8. The epoxy resincomposition according to any one of claims 1, to 4, wherein l+m is apositive number of 2 to
 20. 9. The epoxy resin composition according toany one of claims 1 to 4, wherein the component (a) is one or moreresins selected from the group consisting of novolak epoxy resins,xylylene skeleton-containing phenolic novolak epoxy resins, biphenylskeleton-containing novolak epoxy resins, bisphenol A epoxy resins,bisphenol F epoxy resins, tetramethylbiphenol epoxy resins andtriphenylmethane epoxy resins.
 10. The epoxy resin composition accordingto claim 8, wherein the component (a) is a biphenyl skeleton-containingnovolak epoxy resin represented by the following Formula (2):

(wherein, p is an average having a positive number of 0.1 to 10). 11.The epoxy resin composition according to any one of claims 1 to 4,further comprising a curing accelerator.
 12. A varnish prepared bydissolving the epoxy resin composition according to any one of claims 1to 11 in a solvent.
 13. A varnish comprising the solvent in amounts of10 to 70 wt % and the epoxy resin composition according to claim 12 ofthe balance relative to all amount of the varnish.
 14. The varnishaccording to claim 13, wherein the solvent is a C4 to C6 aliphaticketone solvent.
 15. A sheet, characterized by having a planar backingand one or two layers of the epoxy resin composition according to anyone of claims 1 to 11 formed on one or two faces thereof.
 16. A sheet,characterized by having a cured product layer prepared by curing the oneor two layers of the epoxy resin composition according to any one ofclaims 1 to 11 formed on one or two faces of a planar backing.
 17. Thesheet according to claim 16 or 17, wherein the planar backing is apolyimide film, a metal foil, or a release film.
 18. A prepreg,characterized by being prepared by impregnating a base material with thevarnish according to claim 12 and drying the resulting base material.19. A method of curing an epoxy resin composition, characterized byheating the epoxy resin composition according to any one of claims 1 to11.
 20. A curing agent for epoxy resin, containing, as an activeingredient, a polyamide resin having the structure represented by thefollowing Formula (1):

(wherein, l and m are averages, satisfying the following formula:m/(l+m)≧0.05; and l+m is a positive number of 2 to 200; Ar₁ represents abivaleht aromatic group; Ar₂ represents a phenolic hydroxylgroup-containing bivalent aromatic group; Ar₃ represents:—NH-ph(R₁)n-NH— or—NH-ph(R₂)n-X-ph(R₃)n-NH—, wherein -ph(R₁)n-, -ph(R₂)n- and -ph(R₃)n-represent respectively, R₁-substituted, R₂-substituted andR₃-substituted phenylene groups, or an unsubstituted phenylene group; nis an integer of 0 to 3; R₁, R₂ and R₃ each independently represent a C1to C3 alkyl group or a C1 to C3 alkoxy group; and X represents O, S, CO,SO₂ or a single bond)
 21. The epoxy resin curing agent according toclaim 20, wherein Ar₃ is a group represented by:—NH-ph(R₁)n-NH— or—NH-ph(R₂)n-O-ph(R₃)n-NH—.